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EM430F6137RF900
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EM430F6137RF900 数据手册 (189 页)
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EM430F6137RF900 技术参数、封装参数

EM430F6137RF900 数据手册

TI(德州仪器)
189 页 / 7.68 MByte
TI(德州仪器)
23 页 / 0.93 MByte

EM430F6137 数据手册

TI(德州仪器)
CC430F61xx Wireless Development ToolThe** EM430F6137RF900** is a complete development kit for the CC430F61xx wireless System-on-Chip (SoC) including all the hardware required to develop an entire wireless project. The development kit includes two sub-1GHz wireless target boards featuring the highly integrated CC430F6137IRGC chip.**CC430 wireless target board** Supports CC430F613x and CC430F612x parts in the 64-pin QFN (RGC) package Supports software development for CC430F513x parts in the 48-pin QFN (RGZ) package On-board CC430F6137 SoC, 32KB Flash memory, 4KB RAM Supported carrier frequencies: 868 and 915MHz ISM Bands Reset pushbutton 2 x User LEDs User pushbutton SMA antenna connector JTAG connector Supports SimpliciTI™ low-power network stack Applications: Local wireless communication links for the Internet-of-Things (IoT) **RS Product Codes for Devices** 827-4644 CC430F6137IRGCT QFN64 ### 随附Documentation, 2 x battery holders, 4 x AAA batteries, 2 x 868/915MHz antennas, 2 x 32.768kHz crystals, 18 x PCB 8-pin headers### 单芯片组件,Texas Instruments
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