NTCG103JF103GT1 数据手册 - TDK（东电化）

电阻值(25℃)Resistance in Ohms @ 25°C| 10kΩ \---|--- 电阻容差Resistance Tolerance| 1% B 值容差B Value Tolerance| 1% B0/50| B25/50| B25/75| B25/85| 3435K B25/100| 功耗Power Dissipation| Description & Applications| Small sized 0603 type (L0.6×W0.3×T0.3mm) series are available. • Lead (Pb) free product. By using lead-less terminal electrodes and electroplating (Ni-Sn), this product realized excellent solderablity and soldering heat resistance, comparing with the conventional eutectic mixture solder and lead-free solder (Sn/Ag/Cu, etc.). • Good solderability. • Layered internal electrode structure. • Product series provides a wide range of resistances and B constants. • Good stability of resistance value after soldering. • The 0603, 1608 and 1005 types provide 3 different shapes with identical resistance-temperature characteristics. • Attains less that low floating capacitance (using TCXO) in the high frequency region. 描述与应用| 0603型小型（L0.6×W0.3×T0.3mm）系列。 •铅（Pb）免费产品。 通过使用铅较少的终端电极和电镀（镍锡），该产品实现出色的solderablity和焊接热 性，较与传统的低共熔混合物焊料和无铅焊料（锡/银/铜，等）。 •良好的可焊性。 •分层的内部电极的结构。 •产品系列提供了广泛的电阻和B常数。 •稳定性好，焊接后的电阻值。 •0603，1608和1005提供了3个不同形状的相同的电阻 - 温度特性。 所获，低的浮动电容在高频区域（使用TCXO）。